The ULTIMA® wave soldering system is designed from the ground up for lead-free wave soldering and combines compact size, integrated design and proven laminar wave soldering technology. The machine is available in either an 18″ (457mm), 20″(508mm) or 24″ (609 mm) conveyor width and includes many of the features you would expect in systems selling for twice the price.


To enhance overall production efficiency and minimize downtime, the ULTIMA® is designed with easy access to all fluxing, preheat and solder modules. The Specnor control software has also been upgraded with a WindowsTM10 platform, a new PLC supported by Siemens and the abiltity to connect the machine to the factory network using the latest standards in the electronics manufacturing industry.

Footprint: L= 127’’ W= 61’’ H= 67’’

Power: 220/240, 380/415, 440/480 VAC 50KVA 70A/line at 440 VAC

Exhaust: 1,000 CFM

Shipping weight*: 1,825kg (4,000 lbs)

Operating weight*: 2,725kg (6,000 lbs)

Fixed models: Foam Fluxer or Multi-Head Spray Fluxer

Mobile models: Spray Gun Type or Ultrasonic

18’’, 20’’ and 24’’ standard widths
Conveyor pre adjusted at 6° angle
V-Groove titanium fingers

Bottom forced convection preheat
Topside IR or convection preheat
Full PID control

Laminar and chip wave solder nozzles
Full management of Nitrogen option
Single wave, dual wave, turbulent wave

Windows10® based software
Real-time system graphic animation
Connectivity option*

– Titanium solder module
– L-shaped titanium fingers
– Intermixed L- and V-groove fingers
– Rigid titanium fingers
– Additional convection preheat module
– Topside IR or convection preheaters
– Nitrogen hood
*Contact us for more options


  • Chose from any of Specnor’s proven foam, spray or PowerFlux selective spray fluxing systems
  • Standard convection preheat with available additional bottomside convection, and topside IR or convection preheat modules
  • All titanium solder pot construction specially designed for leadfree operation with quick disconnect laminar and chip wave solder nozzles, titanium impellers and easy to remove solder pumps and flow ducts
  • Easy accessibility to all fluxing, preheating and solder modules including fluxer and preheat rollout, and a motorized solder pot rollout, all as standard features
  • Updated software with a Windows 10® base, a new PLC, a user friendly interface and a new connectivity option following the latest standard in the electronics manufacturing shop floor equipment communication